Pioneering Chip Design

Intelligent Electronic System

Smart Sensor Chip

Research description

Develop key technology for intelligent electronic systems and applications.

Research focuses.

  • Intelligent sensing system platform and applications
  • Edge AI platform and systems
  • Rugged sensing system platform for disaster prevention
  • AIoT platform and systems

Research results

Develop MorSensor/iSOMA/PaS/SenCu intelligent sensing system platform and smart feed drive systems to provide advanced circuit design and system integration support and services for domestic academic and research teams; both academic achievements and patented technology transfer are taken into consideration.

Develop a rugged sensor system and actually install it on the four major bridges in the Zhuoshui River basin in Taiwan.

IC-EMC

Research description

Electromagnetic compatibility of integrated circuits (IC-EMC) measurement technology and design strategy.

Research focuses

  • Measurement technology for IEC-61967 and IEC-62132 standards.
  • Development of wideband IC-EMC measurement technology.
  • Chip-level countermeasure reference designs and IC turnkey design flow.

Research results

Construct measurement technology complied with the IEC standards and EMC countermeasure reference designs. Assist the partners in industry, academia , and government to develop related technology of IC-EMC. Wideband conducted EMC measurement technology: IEC 61967-4 up to 13 GHz, IEC 62132-4 up to 18 GHz.

Antenna-in-Package (AiP) Design

Research description

Millimeter-wave antenna-in-package (mmWave AiP) array research

Research focuses

  • Development of mmWave passive device and AiP technology
  • Development of IPD process technology
  • Antenna array design and simulation

Research results

Develop antenna array design prototype suitable for millimeter wave bands.

Jointly create mass-producible AiP array systems with the industry.

CMOS MEMS Technology

Research description

Technology development for the combo sensor and readout circuit platform.

Research focuses

  • Development of heterogeneous platform and design platform environment.
  • Simulation/design/verification/measurement of multi-sensor device and readout circuits.
  • Development of transducer intellectual property (IP).

Research results

  • Monolithic three-axis CMOS MEMS accelerometer.
  • Self-developed chip-scale heterogeneous packaging technology.
  • Provide one-stop workflow of the integrated sensor chip desgin and fabrication for domestic R&D teams.

Low-power Low-noise SoC

Research description

Sensor system circuit with low-power, low-noise, and auto-calibration capabilities.

Research focuses

  • Low-power, low-noise, and auto-calibration sensor interface and readout circuit IP
  • Sensor system IP integration platform

Research results

Successfully integrate 3-axis accelerometer sensor, readout circuit, ADC, ARM M0 MCU, memory, and calibration circuit in the single chip. It is currently the most highly integrated monolithic 3-axis accelerometer SoC in the world.

Wireless Energy Harvesting Chip Technology

Research description

Self-powered wireless communication sensor chip

Research focuses

  • Miniaturized variety sensor module
  • Wireless energy harvesting, no battery power required

Research results

Successfully integrate different process circuit chips, sensors, and micro-coil IPD chip to make a miniaturized sensor module.