| SNDCT研討會
友善列印 facebook分享(另開新視窗)

會議議程



2023/5/18-DAY1

DAY1 International Conference Hall
08:30-09:30 Registration / Post / Breakfast 
09:30-09:40 Opening Remarks / 侯拓宏主任 Tuo-Hung (Alex) Hou, TSRI Director General
09:40-11:40
Keynote1:徐碩鴻院長 Dean. Shawn S. H. Hsu (College of Electrical Engineering and Computer Science, National Tsing Hua University)
GaN Devices and Circuits for High-Frequency Power Applications
 
Keynote2:葉培德教授 Prof. Peide D. Ye (Elmore Family School of Electrical and Computer Engineering, Purdue University, USA)
Atomically Thin Oxide Semiconductor Transistors for BEOL Logic and Memory Applications
11:40-12:40 Lunch
12:40-14:40 International Conference Hall R307A
Session 1:Emerging Device and Computing Technology / Session Chair:Dr. G. L. Luo
Session 2:Advanced Logic and Memory Technology / Session ChairDr. D.C. Chang
S1-1 吳永俊教授  Prof. Yung-Chun Wu (Department of Engineering and System Science, National Tsing Hua University)
Ferroelectric HZO and Ge:HfO2 Steep Slope FinFET, GAAFET and Multilevel Cell Memory
 
S1-2 高國興副教授  Assoc. Prof. Kuo-Hsing Kao (Department of Engineering and System Science, National Tsing Hua University)
Traditional Si MOS Devices Working at Cryogenic Temperatures for Novel Applications
 
S1-3 謝易叡助理教授 Asst. Prof. E. Ray Hsieh (Department of Electrical Engineering, National Central University)
Computing Paradigm Shift of Energy Efficient Applications: From Logic CMOS to Embedded Inmemory-Computing
S2-1 金雅琴教授 Prof. Ya-Chin King (Department of Electrical Engineering,  National Tsing Hua University)
Logic Non-volatile Memories for Nano-scaled CMOS Technologies, from 2D to 3D 

S2-2 胡璧合副教授 Assoc. Prof. Vita Pi-Ho Hu. (Department of Electrical Engineering, National Taiwan University)
Advanced Volatile and Nonvolatile SRAM Technologies 

S2-3 林彥甫教授 Prof. Yen-Fu Lin. (Institute of Nanoscience and Department of Physics, National Chung-Hsing University)
All-2D Ambipolar Electronics from Transistor, Memory to Artificial Synapses
14:40-14:50 Coffee Break
14:50-16:50  International Conference Hall R307A
Session 3:Optoelectronics and Compound Semiconductor Technology / Session Chair:Dr. Wen-Hsien Huang Session 4:Novel Materials and Device Analysis / Session Chair:Dr. Kun-Lin Lin
S3-1 黃建璋特聘教授 Distinguished Prof. Jian-Jang Huang (Graduate Institute of Photonics and Optoelectronics, National Taiwan University)
GaN Power Semiconductor - Technology, Bottlenecks and Applications
 
S3-2 Soo Min Lee Senior Manager (Veeco Instruments Inc.)
Recent Progress in Single Wafer MOCVD Technology for Compound Semiconductor Materials
 
S3-3 王俊達助理教授 Asst. Prof. Chun-Ta Wang (Department of Photonics of National Sun Yat-sen University)
Tunable Silicon Photonic Devices using Liquid Crystal Claddings
S4-1 邱雅萍特聘教授 Distinguished Prof. Ya-Ping Chiu (Department of physics, National Taiwan University)
Atomic-level Inspection Technology: An Important Step for Nanoscale Device Fabrication
 
S4-2 張守一教授 Prof. Shou-Yi Chang (Department of Materials Science and Engineering, National Taiwan University)
Micro-to-Nanomechanical Analyses & In-situ Microscopic Observation of Deformation Behavior

S4-3 陳健群副教授 Assoc. Prof. Chien-Chun Chen (Department of Engineering and System Science, National Tsing Hua University)
Application and Potential of Atomic Electron Tomography in Novel Semiconductor Components
17:00-18:00
Dinner ( Buffet)


2023/5/19-DAY2

DAY2 International Conference Hall
08:30-09:00 Registration / Breakfast
09:00-11:00 International Conference Hall R307A
Session 5:Advanced Package and Heterogeneous / Session Chair:Han-Ting Hsueh
Session 6:High Frequency, Sensors, MEMS, and Silicon Photonic Technology / Session ChairDr. Kun-Ming Chen
S5-1 林士剛教授  Prof. Shih-kang Lin (Department of Materials Science and Engineering, National Cheng Kung University)
IMC-free Cu-to-Cu and Ag-to-Ag Interconnection: Feasible and Reliable Options

S5-2 張香紘經理 Hsiang-Hung Chang Manager (3D IC Integration Dept. EOSL/ITRI, Taiwan)
Wafer to Wafer Low Temperature Copper/Oxide Hybrid Bonding
 
S5-3 施孟鎧助理教授 Asst. Prof. Meng-Kai Shih (Department of Mechanical and Computer-Aided Engineering, National Formosa University)
Thermal and Mechanical Characterization Analysis of 2.5D IC and Advanced Fan-Out Packaging
S6-1 許恒通教授 Prof. Heng-Tung Hsu (International College of Semiconductor Technology, National Yang Ming Chiao Tung University)
Gain Enhancement Technique for Power Amplifier Design at Ultra-High Frequencies
 
S6-2 李俊興教授 Prof. Chun-Hsing Li (Department of Electrical Engineering, National Taiwan University)
THz Electronics for Sensing and Communication Applications
 
S6-3 彭朋瑞助理教授 Asst. Prof. Pen-Jui Peng (Department of Electrical Engineering, National Tsing Hua University)
A 56-Gb/s PAM-4 Transmitter/Receiver Chipset with Nonlinear FFE for VCSEL-Based Optical Links in 40-nm CMOS
11:00-12:00 Poster Paper Presentation Review
12:00-12:30 Poster Award & Closing Remark & Lunch Box