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競賽主題

1.新興元件技術 EMERGING DEVICE TECHNOLOGY

本主題範圍涵蓋各類新興電子元件技術,特別是奈米元件相關之技術、新穎通道材料、製程技術、物理與可靠性分析以及基於新型元件的小型電路製作等,包含(但不限定)以下領域之論文。 The session calls for papers in emerging device technologies, including but not limited to:(1) Nano Device Technology; (2) High Mobility Channel MOSFETs; (3) High-k/Metal Gate Materials; (4) Process Technology; (5) TFT; (7) Nano Device Applications of 2D Materials; (8) Device Modeling and Simulation; (9) Reliability; (10) Small Circuits Based on Novel Devices。
 
2.先進邏輯及記憶體技術 ADVANCED LOGIC and MEMORY TECHNOLOGY

本主題範圍包括先進邏輯及新興記憶體技術,但不限於以下主題: 應用於人工智慧(Artificial Intelligence)、物聯網(Internet of Things)、記憶體內計算 (In-memory computing)、量子計算(Quantum Computing)、高效能計算(High-performance Computing)、低功率與低電壓應用(Low power and Low voltage)、車用電子(自動駕駛與高密集計算)、下世代行動通訊(5G, Beyond 5G, and 6G)等領域所需之。 The session call for papers describing advanced logic and emerging memory applications in AI, IoT, in-memory computing, quantum computing, high-performance computing, low power and low voltage, automobile electronics and 5G/beyond 5G mobile communications.

3.化合物半導體技術 COMPOUND SEMICONDUCTOR TECHNOLOGY
本主題涵蓋了各類前瞻化合物半導體(包括砷化鎵、磷化銦、氮化鎵、碳化矽、氮化鎵及其他材料)製程技術、前瞻元件與電路應用,但不限於以下主題:新型化合物半導材料/製程、新型高功率/射頻元件結構、高溫高壓電子元件與電路、微波和毫米波功率放大器/振盪器/開等電路、元件理論及物理、元件可靠度及化合物半導體元件和電路的新應用 The session call for papers describing advanced processes, devices and circuits for compound semiconductor. The topics includes advanced compound semiconductor material/process; new power/RF device structure; high-voltage or high-temperature electron devices and circuits; microwave and millimeter-wave amplifiers, oscillators, switches, and other ICs; theory and physics of electron devices; device reliability; novel applications utilizing compound semiconductor devices and circuits.

4.新穎半導體材料與元件分析技術 NOVEL MATERIALS and DEVICE ANALYSIS
本主題範圍涵蓋各類檢測技術於新穎半導體材料應用,以及最新檢測技術發展與應用,包含(但不限定)以下領域之論文: (1)材料影像分析技術:掃描式電子顯微鏡(SEM)、掃描探針顯微鏡(SPM)及穿透式電子顯微鏡(TEM)(2)材料晶體結構分析技術:X光繞射(XRD)及穿透式電子顯微鏡擇區繞射(SADP/TEM); (3)材料成分分析技術:歐傑電子儀(AES)、X光光電子能譜儀(XPS)、二次離子質譜儀(SIMS)及傅立葉轉換紅外光譜儀(FTIR)、拉曼光譜(Raman); (4)材料機械及電性特性分析技術:奈米壓痕、展阻分析(SRP)、霍爾量測及微分霍爾量測(DHEM)。 This topic covers all aspects of novel measurement technologies on semiconductor materials, including but not limited to: (1) Scanning Image Analysis: Scanning electron microscopy (SEM), Scanning probe microscopy (SPM), and Transmission electron microscopy (TEM) (2)Structural Diffraction Analysis: X-ray diffraction (XRD) and Selected area diffraction pattern (SADP)/TEM (3)Chemical Elemental Analysis: Auger electron spectrometer (AES), X-ray photoelectron spectroscopy (XPS), Secondary Ion Mass Spectroscopy (SIMS), Fourier-transform infrared spectroscopy (FTIR), and Raman Spectroscopy (Raman) (4)Mechanical and Electrical Properties Analysis: Nano-indentation, Spreading resistance profiling (SRP), Hall effect Measurement, and Differential Hall Effect Metrology (DHEM).

5.先進異質整合技術 ADVANCED HETEROGENEOUS INTEGRATION
本主題範圍涵蓋各類先進異質元件封裝整合技術如2.5D/3D/矽穿孔/中介層技術、物聯網/生醫/功率/可穿戴式元件封裝整合應用等,包含(但不限定)以下領域之論文。 This session solicit papers mainly focus on advanced heterogeneous integration in areas such as 2.5D/3D/TSV/interposer technology and IOT/MEMs/health/wearable emerging devices, but not limited to: (1) 2.5D/3D integrated circuits and its interconnect design, (2) fan-out wafer/panel level packaging, (3)reliability test for electronic packaging and simulation, (4)Material characteristics in electronic packaging and its thermo-mechanical behaviors and (5) innovative technologies and architectures of ESD.

6.高頻、感測器與矽光子元件及電路技術 HIGH-FREQUENCY, SENSOR and SILICON PHOTONIC DEVICE AND CIRCUIT TECHNOLOGIES
本主題範圍涵蓋三大部分, 第一部分是射頻/微波/毫米波領域元件、電路與系統之技術與應用,包含(但不限定)以下領域之論文。 The topic call for papers covering two parts. The first part includes but not limited to High-frequency Device Fabrication, Characterization and Modeling; (2) High-frequency Circuit Design and Simulation; (3) High-frequency Systems and Applications; (4) High-frequency Passive Devices; (5) High-frequency Measurement Techniques and EM Field Analysis; (6) Antennas and Propagation. 

第二部分是前瞻感測器、電路與系統之技術與應用,涵蓋微機電致動器、微機電與奈米生化感測器,包含(但不限定)以下領域之論文。This session scope of this topic covers two parts. The first part focuses on advanced sensors, design and integration, including (1) MEMS Actuator; (2) MEMS Sensor; (3) MEMS Process Technology; (4) CMOS MEMS Sensor and Readout Circuit Integration; (5) MEMS Package & Testing; (6) Nano-scale Film; (7) Biosensors and Nano-structured Sensors; (8) Biomaterials Used for the Electronic Devices; (9) Electronic Manipulation of Biomolecules; (10) Bio-fuel Cells; (11) Biomedical Devices or Diagnostics.

第三部分是高速接口傳輸電路技術與矽光子相關之技術與應用,包含(但不限定)以下領域之論文: The second part includes but not limited to the following works: High-speed wireline and high-speed interfaces; (2) High-speed transceiver and receive; (3) Silicon photonic device and technology; (4) Silicon photonic optical transceivers and receivers; (5) Optical transmitters above 100 Gb/s.