徵稿主題
1. 新興元件與運算技術 Emerging Devices and Computing Technologies
Nano-device technology; process technology; high-mobility channel MOSFETs; high-k/metal gate materials; negative capacitance FET; TFT; device applications of low‐dimensional materials; qubit devices; quantum computing; reliability; device modeling and simulation.
2.先進邏輯與記憶體技術 Advanced Logic and Memory Technologies
Logic devices and circuits; embedded and standalone memory technology; conventional and emerging memories (SRAM, DRAM, Flash, ReRAM, MRAM, and ferroelectric memory…etc.); design/system technology co-optimization (DTCO/STCO); novel integration /circuit design schemes and architectures in artificial intelligence, internet of things, compute-in-memory, high-performance computing, low power, and low voltage applications.
3.高頻與功率元件電路及化合物半導體技術 High-Frequency and Power Device Circuits, and Compound Semiconductor Technologies
Compound semiconductor materials and devices; high-electron mobility transistors (HEMTs); heterojunction bipolar transistors (HBTs); heterostructures; monolithic integration; E/D-mode; epitaxy technology; thermal management; power ICs; power device characterization, modeling, simulation and reliability; high-frequency devices and circuits; MMICs; RFICs; millimeter-wave, sub-THz, and THz integrated circuits; antenna theory, design and measurement; MIMO antennas; beamforming and multi-beam systems.
4.微機電、感測器、先進封裝與異質整合技術 MEMS, Sensors, Advanced Packaging, and Heterogeneous Integration
Microelectromechanical Systems (MEMS); Sensors; Heterogeneous Integration; Advanced Packaging; Wafer-Level Packaging; Fan-Out Packaging; 2.5D/3D Packaging; Silicon Interposer; Through-Silicon Via (TSV); Micro Bump; High-Density Interconnect (HDI); System-in-Package (SiP)
5. 光電與矽光子技術Optoelectronics and Silicon Photonics
Advanced in Photonic devices for high-speed photodetectors and modulators, and light sources; Photonic-electronic integration for optical interconnects; Metalens for augmented or virtual reality and holography; Quantum photonics for computation, sensing and encryption, Optical Sensing devices for single-photon sensitivity, Time-Of-Flight (ToF) and nonvisible image sensors, in-display sensors and imaging sensors; Imagers for high-speed and high-time resolution CMOS imagers, SPAD imagers, and CCD imagers; TFTs for photonics applications; Flexible, stretchable, and/or printed electronics; Light emitting devices, Perovskites or quantum dots optical devices; Semiconductor lasers.
6. 新穎材料檢測與分析技術 Novel Materials Characterization and Analysis
Scanning electron microscopy (SEM); Scanning probe microscopy (SPM); Transmission electron microscopy (TEM) with selected area diffraction pattern (SADP); X-ray diffraction (XRD); Auger electron spectrometer (AES); X-ray photoelectron spectroscopy (XPS); Secondary Ion Mass Spectroscopy (SIMS); Fourier-transform infrared spectroscopy (FTIR); Raman spectroscopy; atom probe tomography (APT); Nano-indentation, Spreading resistance profiling (SRP); Hall effect Measurement; Differential Hall Effect Metrology (DHEM).
● 徵稿海報Call for Papers：下載
● 投稿範本Submission Template：下載
請使用投稿範本撰寫論文，並在範本首頁中勾選參加論文口頭競賽或優良海報競賽。獎項資訊請參閱投稿資訊中獎項說明。
Please use the template to prepare your paper, and indicate to participate in the Oral Presentation Competition or the Best Poster Competition on the first page. For awards information, please refer to the submission guidelines.
● 最後截稿日期：2026年3月8日； 預計2026年4月2日通知論文審查結果。
Final deadline: March 8, 2026; The paper review results are expected to be notified on April 2, 2026.
● 提醒：獲論文入選同學務必於2026年4月30日前完成研討會報名及繳費。Reminder: Students whose papers are selected must complete the seminar registration and payment before April 30, 2026.
● 早鳥優惠期間 :3月16 ~ 4月15日完成報名及繳費，敬請把握。Early bird discount period: Registration and payment must be completed from March 16th ~ April 15th, so please take advantage.
Nano-device technology; process technology; high-mobility channel MOSFETs; high-k/metal gate materials; negative capacitance FET; TFT; device applications of low‐dimensional materials; qubit devices; quantum computing; reliability; device modeling and simulation.
2.先進邏輯與記憶體技術 Advanced Logic and Memory Technologies
Logic devices and circuits; embedded and standalone memory technology; conventional and emerging memories (SRAM, DRAM, Flash, ReRAM, MRAM, and ferroelectric memory…etc.); design/system technology co-optimization (DTCO/STCO); novel integration /circuit design schemes and architectures in artificial intelligence, internet of things, compute-in-memory, high-performance computing, low power, and low voltage applications.
3.高頻與功率元件電路及化合物半導體技術 High-Frequency and Power Device Circuits, and Compound Semiconductor Technologies
Compound semiconductor materials and devices; high-electron mobility transistors (HEMTs); heterojunction bipolar transistors (HBTs); heterostructures; monolithic integration; E/D-mode; epitaxy technology; thermal management; power ICs; power device characterization, modeling, simulation and reliability; high-frequency devices and circuits; MMICs; RFICs; millimeter-wave, sub-THz, and THz integrated circuits; antenna theory, design and measurement; MIMO antennas; beamforming and multi-beam systems.
4.微機電、感測器、先進封裝與異質整合技術 MEMS, Sensors, Advanced Packaging, and Heterogeneous Integration
Microelectromechanical Systems (MEMS); Sensors; Heterogeneous Integration; Advanced Packaging; Wafer-Level Packaging; Fan-Out Packaging; 2.5D/3D Packaging; Silicon Interposer; Through-Silicon Via (TSV); Micro Bump; High-Density Interconnect (HDI); System-in-Package (SiP)
5. 光電與矽光子技術Optoelectronics and Silicon Photonics
Advanced in Photonic devices for high-speed photodetectors and modulators, and light sources; Photonic-electronic integration for optical interconnects; Metalens for augmented or virtual reality and holography; Quantum photonics for computation, sensing and encryption, Optical Sensing devices for single-photon sensitivity, Time-Of-Flight (ToF) and nonvisible image sensors, in-display sensors and imaging sensors; Imagers for high-speed and high-time resolution CMOS imagers, SPAD imagers, and CCD imagers; TFTs for photonics applications; Flexible, stretchable, and/or printed electronics; Light emitting devices, Perovskites or quantum dots optical devices; Semiconductor lasers.
6. 新穎材料檢測與分析技術 Novel Materials Characterization and Analysis
Scanning electron microscopy (SEM); Scanning probe microscopy (SPM); Transmission electron microscopy (TEM) with selected area diffraction pattern (SADP); X-ray diffraction (XRD); Auger electron spectrometer (AES); X-ray photoelectron spectroscopy (XPS); Secondary Ion Mass Spectroscopy (SIMS); Fourier-transform infrared spectroscopy (FTIR); Raman spectroscopy; atom probe tomography (APT); Nano-indentation, Spreading resistance profiling (SRP); Hall effect Measurement; Differential Hall Effect Metrology (DHEM).
● 徵稿海報Call for Papers：下載
● 投稿範本Submission Template：下載
請使用投稿範本撰寫論文，並在範本首頁中勾選參加論文口頭競賽或優良海報競賽。獎項資訊請參閱投稿資訊中獎項說明。
Please use the template to prepare your paper, and indicate to participate in the Oral Presentation Competition or the Best Poster Competition on the first page. For awards information, please refer to the submission guidelines.
● 最後截稿日期：2026年3月8日； 預計2026年4月2日通知論文審查結果。
Final deadline: March 8, 2026; The paper review results are expected to be notified on April 2, 2026.
● 提醒：獲論文入選同學務必於2026年4月30日前完成研討會報名及繳費。Reminder: Students whose papers are selected must complete the seminar registration and payment before April 30, 2026.
● 早鳥優惠期間 :3月16 ~ 4月15日完成報名及繳費，敬請把握。Early bird discount period: Registration and payment must be completed from March 16th ~ April 15th, so please take advantage.