徵稿主題
1.新興元件與運算技術 Emerging Device and Computing Technology
Nano-device technology; process technology; high-mobility channel MOSFETs; high-k/metal gate materials; negative capacitance FET; TFT; device applications of low‐dimensional materials; qubit devices; quantum computing; reliability; device modeling and simulation.
2.先進邏輯與記憶體技術 Advanced Logic and Memory Technology
Logic devices and circuits; embedded and standalone memory technology; conventional and emerging memories (SRAM, DRAM, Flash, ReRAM, MRAM, and ferroelectric memory…etc.); design/system technology co-optimization (DTCO/STCO); novel integration /circuit design schemes and architectures in artificial intelligence, internet of things, compute-in-memory, high-performance computing, low power, and low voltage applications.
3.高頻、功率元件電路與化合物半導體技術 High Frequency, Power Devices and Circuits, and Compound Semiconductor Technology
Compound semiconductor materials and devices; high-electron mobility transistors (HEMTs); heterojunction bipolar transistors (HBTs); heterostructures; monolithic integration; E/D-mode; epitaxy technology; thermal management; power ICs; power device characterization, modeling, simulation and reliability; high-frequency devices and circuits; MMICs; RFICs; millimeter-wave, sub-THz, and THz integrated circuits; antenna theory, design and measurement; MIMO antennas; beamforming and multi-beam systems.
4.微機電、感測器與異質整合先進封裝技術 MEMS, Sensors, Advanced Packaging, and Heterogeneous Integration
Microelectromechanical Systems (MEMS); Sensors; Heterogeneous Integration; Advanced Packaging; Wafer-Level Packaging; Fan-Out Packaging; 2.5D/3D Packaging; Silicon Interposer; Through-Silicon Via (TSV); Micro Bump; High-Density Interconnect (HDI); System-in-Package (SiP)
5.光電與矽光子技術Optoelectronics and Silicon Photonics
Advanced in Photonic devices for high-speed photodetectors and modulators, and light sources; Photonic-electronic integration for optical interconnects; Metalens for augmented or virtual reality and holography; Quantum photonics for computation, sensing and encryption, Optical Sensing devices for single-photon sensitivity, Time-Of-Flight (ToF) and nonvisible image sensors, in-display sensors and imaging sensors; Imagers for high-speed and high-time resolution CMOS imagers, SPAD imagers, and CCD imagers; TFTs for photonics applications; Flexible, stretchable, and/or printed electronics; Light emitting devices, Perovskites or quantum dots optical devices; Semiconductor lasers.
Scanning electron microscopy (SEM); Scanning probe microscopy (SPM); Transmission electron microscopy (TEM) with selected area diffraction pattern (SADP); X-ray diffraction (XRD); Auger electron spectrometer (AES); X-ray photoelectron spectroscopy (XPS); Secondary Ion Mass Spectroscopy (SIMS); Fourier-transform infrared spectroscopy (FTIR); Raman spectroscopy; atom probe tomography (APT); Nano-indentation, Spreading resistance profiling (SRP); Hall effect Measurement; Differential Hall Effect Metrology (DHEM); Device reliability; Hot carrier phenomena; Bias temperature instability; Charge trapping; Thermal effect; Flicker noise; RTN; Dielectric breakdown; Failure analysis; Electromigration; Device dynamic characterization; Parameter extraction method.
● 徵稿海報Call for Papers：下載
● 投稿範本Submission Template：下載
● 最後截稿日期：2025年3月31日； 預計2025年4月16日通知論文審查結果。
Final deadline: April 31, 2025; The paper review results are expected to be notified on April 16, 2025.
● 提 醒：獲論文入選同學務必於2025年5月11日前完成研討會報名及繳費。Reminder: Students whose papers are selected must complete the seminar registration and payment before May 11, 2025.
● 早鳥優惠期間 : 4月1-30日完成報名及繳費，敬請把握。Early bird discount period: Registration and payment must be completed from April 1st to 30th, so please take advantage.
6.新穎材料檢測分析技術 Novel Materials Characterization
Scanning electron microscopy (SEM); Scanning probe microscopy (SPM); Transmission electron microscopy (TEM) with selected area diffraction pattern (SADP); X-ray diffraction (XRD); Auger electron spectrometer (AES); X-ray photoelectron spectroscopy (XPS); Secondary Ion Mass Spectroscopy (SIMS); Fourier-transform infrared spectroscopy (FTIR); Raman spectroscopy; atom probe tomography (APT); Nano-indentation, Spreading resistance profiling (SRP); Hall effect Measurement; Differential Hall Effect Metrology (DHEM); Device reliability; Hot carrier phenomena; Bias temperature instability; Charge trapping; Thermal effect; Flicker noise; RTN; Dielectric breakdown; Failure analysis; Electromigration; Device dynamic characterization; Parameter extraction method.
● 徵稿海報Call for Papers：下載
● 投稿範本Submission Template：下載
● 最後截稿日期：2025年3月31日； 預計2025年4月16日通知論文審查結果。
Final deadline: April 31, 2025; The paper review results are expected to be notified on April 16, 2025.
● 提 醒：獲論文入選同學務必於2025年5月11日前完成研討會報名及繳費。Reminder: Students whose papers are selected must complete the seminar registration and payment before May 11, 2025.
● 早鳥優惠期間 : 4月1-30日完成報名及繳費，敬請把握。Early bird discount period: Registration and payment must be completed from April 1st to 30th, so please take advantage.