Milestones
2022
- TSRI teamed up with National Taiwan University to build the Chip Design Security Lab.
2020
- TSRI completed the development of the “AI SoC Design and Verification System,” accelerating domestic teams’ research on real-time computing and low-power AI chips.
- TSRI became not only Arm’s first partner in Asia in the “AI computing IP” field, but also its first corporate partner around the world.
- The opening ceremony of the “Tainan Base of Taiwan Semiconductor Research Institute” was organized.
2019
- CIC and NDL were merged into the “Taiwan Semiconductor Research Institute,” which was the world’s only national technology research and development center integrating IC design, chip tape-out implementation, and semiconductor device process researches.
2018
- The “Nanochip Center’s Tainan Base” project commenced base construction.
2017
- CIC transitioned and was certified to the latest version of ISO 9001:2015 Quality Management System.
- The “Antibiotic Susceptibility Testing Chip” developed jointly by NDL and Taichung Veterans General Hospital was launched.
- The “Nanochip Center’s Tainan Base” project initiated by NDL and National Cheng Kung University commenced construction.
2016
- NDL launched the “Smart Gas Sensing Chip” technology that is miniaturized, low-power, and easy to integrate.
2015
- CIC created and expanded an offsite backup for its EDA Cloud in the Taichung Branch of the National Center for High-performance Computing.
- NDL combined, for the first time, TSV-free monolithic 3D ICs with ambient light energy harvesting technology to realize the development of low-cost and self-powered IoT chip technologies.
- NDL organized the International Workshop on Epitaxial Growth and Fundamental Properties of Semiconductor Nanostructures (SemiconNano2015), with nearly 100 participating experts and scholars from all over the world.
2014
- CIC transitioned and was certified to the latest version of ISO/IEC 27001:2013 Information Security System.
- The monolithic 3D IC technology developed and innovated by NDL reduces the thickness of each layer of a monolithic 3D IC by 150 times and can more significantly increase signal transmission speed and better reduce energy loss in comparison with traditional TSV technology.
- NDL developed a sub-10 nm N-type device combining 2D materials with fin field effect transistors (FinFETs), which can increase the drive current by up to 25%.
2013
- CIC launched the EDA Cloud Service.
- NDL formed the “Nano Device Innovation Consortium.”
- NDL developed a fin field effect transistor with two fin heights, which can reduce the embedded SRAM chip area by up to 20%.
- The nanocrystal memory technology innovated by NDL was 10 to 100 times faster than the current mainstream charge storage memory products.
- NDL built a process service platform for high-efficiency CIGS solar cells with up to 10% conversion efficiency.
2012
- CIC launched the self-developed “Smart Sensing Single Chip” that was recognized as a winner in NARLabs’ 6th Outstanding Science and Technology Contribution Award.
- The “Technology for Quick Identification of Rare Pathogenic Bacteria in Blood” developed by NDL was a winner in the “9th National Innovation Award.”
- The “Monolithic 3D-IC” developed by NDL was recognized at the International Electron Devices Meeting (IEDM).
2011
- CIC’ s Tainan Office formed the Security Lab.
- CIC developed the world’s first smart electronic system R&D platform centering around “MG+4C” applications.
- CIC started to provide the academic community with the TSMC 40nm process service for chip fabrication.
- NDL developed the “Silicon-based Solar Device for Self-powered Line Modules” with high applicability.
- The NDL-developed “Triangular Germanium FinFET” technology can increase the operation speed of silicon planar transistors by 2 to 4 times.
- NDL developed the “Vertical Silver Wire Technology” that could overcome the bottleneck of the traditional W-plug structure process.
2010
- CIC started to offer CMOS/IPD integration process and manufacturing services.
- CIC started to provide the academic community with the TSMC 0.25µm 60V high-voltage process service for chip fabrication.
- NDL developed the world’s smallest 9nm functional R-RAM array cell.
- NDL developed Taiwan’s first CMOS-MEMS R&D platform system for SOI and 1P4M built by an academic R&D institute.
2009
- The world’s first bio-sensing system service platform developed by CIC realized innovative smart home care.
- CIC was certified to the latest revision of ISO 9001:2008 Quality Management System.
- NDL developed the world’s first 16nm functional SRAM unit cell. NDL developed the world’s first “Non-current-driven Silicon Quantum Dot” storage device.
- The NDL-developed low-temperature microwave annealing and activation process was used to fabricate the world’s first transistor activated at a temperature less than 320°C.
2008
- CIC developed the scalable and convenient “Modular FPGA System Development Platform.”
- NDL developed the world’s first silicon-based ferroelectric memory.
2007
- CIC set up a chip design laboratory on 7F of the Chi-Mei Building in National Cheng Kung University.
- CIC and NDL together formed the Southern Region Office in the Chi-Mei Building of National Cheng Kung University.
- NDL was certified to ISO17025 for providing standardized, accurate, and quick material analysis and testing services.
2006
- NDL and United Microelectronics Corporation signed the “UMC-NDL Youth Scholar Scholarship Cooperation Agreement” to nurture elite talent for nanodevices in Taiwan.
- CIC was certified to ISO9001:2000 Quality Management System, improving the quality of self-operation of processes and technologies as well as talent training services.
- CIC started to offer the 0.18µm CMOS MEMS integrated process platform.
- CIC was the first in the world to provide the academic community with a low-cost SoC implementation environment.
2005
- NDL and Agilent Technologies signed the “Wafer-level High-frequency Device Automatic Test and Analysis Technology Cooperation Agreement” to build the long-term partnership between both parties and join forces for Taiwan’s semiconductor industry.
- CIC created and expanded an offsite backup for its EDA Cloud in the Taichung Branch of the National Center for High-performance Computing.
- CIC was the world’s first to launch a 0.13µm CMOS integrated process platform.
2004
- CIC set up the “SoC and Mixed-Signal Chip Debugging Platform.”
- NDL built and equipped the “Nano Electronics Research Building” with equipment.
2003
- CIC’s national science and technology program won the Outstanding National Science and Technology Program Award.
- NDL and CIC were reorganized into “National Applied Research Laboratories.”
2002
- National Nanometer Device Laboratories was renamed “National Nano Device Laboratories.”
- NDL formed the Southern Region Office and built a semiconductor research environment in the Tainan Science Park in line with the national South-North balance policy.
1997
- “Chip Design and Fabrication Center” was renamed “National Chip Implementation Center.”
1993
- National Sub-micron Device Laboratories was renamed “National Nanometer Device Laboratories.”
- National Science and Technology Council (NSTC)’s “Chip Design and Fabrication Center” was officially unveiled and put into use in the Hsinchu Science-Based Industrial Park. CLC’s Director Zhen-Sheng Huang took office in the same year.
1992
- National Sub-micron Device Laboratories’ Class 10 clean room was officially put into operation to offer high-quality device research services to industry and academic communities.
- NSTC’s Department of Engineering and Technologies’ Director General Chung-Yu Wu and Professor Wen-Zen Shen promoted a project plan for building the “Chip Design and Implementation Center.”
1988
- Taiwan’s first national semiconductor device laboratory was built, and the Executive Yuan-approved name was “National Sub-micron Device Laboratories.”