Taiwan Semiconductor Research Institute

Tape-out Guidelines

Please select the chip type:

(1) This webpage provides a comprehensive overview of the tape-out process, including all steps from pre-application work to case closure.

It covers tape-out preparation, application procedures, reply of review comments, and test report submission, with clear explanations for each step.

(2) Before tape-out application, please pre-submit relevant documents.

No.	Document	Description
1	Intellectual Property Rights Affidavit	Professors must submit one IPR Affidavit every year. After completing the document, including signing and stamping, professors are kindly requested to email the scanned file (PDF format or image file format) to cisd_prouser@niar.org.tw The 2025 Intellectual Property Rights Affidavit is now available for download. Professors planning to apply for chip manufacturing can download the form, and submit it via email before applying for chip manufacturing.
2	The Class Roster and Excel File	Professors who intend to apply for educational chips are requested to provide the following #1 and #2 documents at the beginning of each semester. The Class Roster of the course (as shown in the example on the right link) must be stamped with the department seal and signed by the instructor, and converted into a PDF format or image file. Please download the Excel file and complete the forms (Note 1 and 2). Please email the electronic file of the Class Roster and the Excel file to cisd_edu@niar.org.tw Note 1：Students who take courses must become our members before applying for educational chip manufacturing. It is recommended that students who intend to apply for educational chip manufacturing complete the membership registration and ask the professor to complete the consent certification before sending the Class Roster and the Excel file. Note 2：The email address of the student taking the course in the Excel file must match the email address in the member account.	Sample of the Class Roster
2	The Class Roster and Excel File		Excel File Download
3	New Faculty Qualifications Inquiry Letter	For new professor with less than two years of service, TSRI annually provides a preferential service allowing up to 7 chips (after passing the chip review) to be manufactured, with a total value not exceeding NTD500,000 (based on academic full price pricing). This service is processed with a 100% accounting method, and there is no additional charge. Those who meet the qualifications of new professors, please fill in the verification form, seal it with the department stamp, scan it into an electronic file, and send it to: cisd_prouser@niar.org.tw

(3) Tape-out Pre-application Steps, please read the following carefully for application.

No.	Document
1	Guidelines and Instructions for Applying for	Advanced Chip (including partial-price, new-faculty discount, superior chip discount)
1	Guidelines and Instructions for Applying for	Educational Chip
2	Chip Tape-out Schedule	Year 2025
2	Chip Tape-out Schedule	Year 2024
3	Chip Manufacturing Service Contact
4	Notes on Tape-out Application
5	Tape-out Application Website Instructions and Notes

(4) Tape-out Application Steps

Please complete Step 0 by 16:00 on the working day before the application deadline, and upload required documents for tape-out eligibility. The application form filling and file uploading service will be closed at 14:00 on the deadline day. Applicants must make sure to complete the application form and double-check the completion of all uploads as described in Step 4 by 14:00 on the deadline day.

Tape-out Application-Step 0 > Check Eligibility and Submit Documents.
Please go to TSRI website > Chip Implementation > Tape-out Application > Tape-out New Application > Relevant Links on the right side of the webpage > View Tape-out Eligibility
(1) The professor has applied for and been approved for use of the chip implementation.
(2) The student has been authorized to use the chip implementation.
(3) The applicant has no pending test report.
(4) The professor has submitted the Intellectual Property Rights Affidavit for the current year.
(5) The Class Roster has been submitted for the educational chip manufacturing.
Tape-out Application-Step1 > Select Process/MPW Schedule/Chip Type
Please go to TSRI website > Chip Implementation > Tape-out Application > Tape-out New Application > Select Process/MPW Schedule/Chip Type
Applicants should note that advanced chips (including partial-price, new faculty discounts, and superior chips discounts) are related to fees/reviews/discounts. Please confirm the chip type before your application.
Tape-out Application-Step2 > Read Application Guidelines
 The screen displays application guidelines and instructions. Please click the confirmation button after reading.
Tape-out Application-Step3 > Fill in the Application Form.
Please fill in relevant information based on the application form. ※After the application form is completed, if the applicant does not meet the tape-out eligibility, the system will prompt you to submit the documents.
Please send all the documents to the TSRI contact by email; the documents sent before 16:00 on each working day will take effect before 17:00 on the same day. Please complete the application form as soon as possible. This will allow the system to review your tape-out qualifications in time to avoid any delay in submitting your documents before the application deadline.

Tape-out Application-Step4 > Please Upload the Electronic Files before the Application Deadline.
Files numbered 1 to 5 in the chart below should be uploaded to TSRI website, and file no. 7 should be sent to the engineer in charge of each process by email before the application deadline.

No.	Document		Download
1	Design Content Electronic File *Note 1	Advanced Chip Example
1	Design Content Electronic File *Note 1	Educational Chip Example
2	GDS File		-
3	DRC Verification Result File	Example
4	LVS Verification Result File	Example
5	Tape Out Review Form *Note 2	Cell-Base Form
		Cell-Base Example
		Full-Custom Form
		Full-Custom Example
6	Wire Bonding Diagram *Note 3	All Sorts of Samples
6	Wire Bonding Diagram *Note 3	Example
7	Application Form of the DRC Violation *Note 4	Please contact the person in charge of each process first and send it by email.

Note 1: Documents should be in MS Word format.
Note 2: The filename for Tape-out Review Form upload must be TRF.doc
Note 3: The wire bonding diagrams of advanced chips and educational chips are included in the "Design Content Electronic File" and do not need to be submitted separately. If packaging is not required, no wire bonding diagram is necessary.
Note 4: Please submit "Application Form for DRC Violation in Chip Manufacturing" before each MPW schedule deadline as it requires submission to the wafer manufacturer for review, and it is limited to one submission to avoid the time-consuming process of going back and forth.

Tape-out Application-Step 5 > Check the Information of GDS File.
Please go to TSRI website > Chip Implementation > Tape-out New Application > Tape-out Application General Form, and click the button in the information column of each GDS file.
Please confirm whether the layout-related information and DRC results are correct on the information page of the GDS file. If there are DRC errors in your layout, please refer to the following:

No.	Document	Download
1	Explanation Webpage of the DRC Allowing Violation for each process （If there is a DRC error in the layout, please click this link to confirm the DRC problem.）

Tape-out Application-Step 6 > Confirmation
After double-checking on the tape-out application form, the uploads of related files, and GDS file, please go to the application summary, and click the "Submit" button before the application deadline. Alternatively, at the bottom of the GDS file viewing page, you can also press the "STEP 6: Confirm and send" button to complete the application.

※Please inform the professor to go to TSRI website to sign and approve the chip manufacturing within 16 days from the next day of the application deadline to 16 days after the deadline (the deadline is based on the time listed in the notification letter received by the professor). Please go to TSRI website > Chip Implementation > Tape-out Approval page to sign.
(5) Response to Review Comments
Please bring reference materials and slide files for the review meeting to the review site on the day of the meeting. This requirement does not apply to written reviews or cases exempt from review.

No. Document Download

1 Review Meeting Presentation Slides Example
Following the review meeting, TSRI will publish the review results.
Please go to TSRI website > Chip Implementation > Tape-out Application > Tape-out New Application > Tape-out Application General Form
Check the review results and committee feedback in the column of the review results; upload feedback and modified GDS file in the column of the review comment reply.

(6) Upload Test Report Files
Please complete testing within two months of receiving the chip, and upload the electronic test report. Visit TSRI Website > Chip Manufacturing > Test Report

No.	Document	Download
1	Review Meeting Presentation Slides Example

Appendix: Reference Documents

No.	Document
1	Advanced Chip Application and Review Procedures	Advanced Chip
1	Advanced Chip Application and Review Procedures	Educational Chip
2	Chip Arrangement and Notice