Taiwan Semiconductor Research Institute, NARLabs.

Advanced Fabrication Technologies

To improve process capability and integrate national resources, the Taiwan Semiconductor Research Institute (TSRI) has built a next-generation device manufacturing and integration technology research platform, formed various work teams for information security/facilities/occupational safety management, and provided users with a safe use environment. TSRI also looks forward to working with academic and research communities in the R&D of advanced semiconductor manufacturing and nanofabrication processes and device technologies, fostering the top tech talent desperately needed by the academic and industry communities, and combining the strength of the industry, academic and research communities for the development of advanced device technologies, thereby lowering the investment risk that may arise from technical bottlenecks while boosting the independent R&D capabilities of semiconductor-related industries in Taiwan.

TSRI opens up three integrated service platforms. For actual fees, please refer to the Price List. Contact: Mr. Lai Tel.: 03-5773693 ext. 7776

Monolithic 3D Integrated Circuit Technology

Low-thermal-budget FinFET-based 3D integrated circuit without through-silicon via (TSV).

Next Generation Device Technology

R&D platform for next-generation device technology.

GaN Power Device Technology

Development of GaN power management technologies that can be used in high-speed wireless communication and fully autonomous vehicles based on all-GaN ICs.

Innovative Memory

Next-generation high-speed, low-power memory technology service platform.