PCB Process/ Schedule / Contact
PCB Process
| PCB Process Code | PCB Fabrication Substance | Stackup |
Metal Line Minimum Width / Spacing (mm) |
Drill Hole Minimum / Maximum Size (mm) |
|
|---|---|---|---|---|---|
| PCB_2L |
FR4 2-Layer Board
|
 |
0.1 / 0.1 | 0.20 / 6.00 | |
| PCB_4L | FR4 4-Layer Board |
 |
0.1 / 0.1 | 0.20 / 6.00 | |
| PCB_2LHF16 |
RO 2-Layer High Frequency Board
|
 |
0.1 / 0.1 | 0.20 / 6.00 | |
| PCB_4LMX | RO-FR4 4-Layer Complex Board |
 |
0.1 / 0.1 | 0.20 / 6.00 | |
PCB Schedule
| Batch | Application Start Date | Application Deadline | Payment Approval Deadline | PCB Shipment Date |
|---|---|---|---|---|
|
PCB_2L_114A
PCB_4L_114A
PCB_2LHF16_114A PCB_4LMX_114A |
2024.12.23 |
2024.12.30 |
2025.01.16 |
2025.02.07 |
|
PCB_2L_114B
PCB_4L_114B
PCB_2LHF16_114B PCB_4LMX_114B |
2025.02.17 |
2025.02.24 |
2025.03.13 |
2025.03.28 |
|
PCB_2L_114C
PCB_4L_114C
PCB_2LHF16_114C PCB_4LMX_114C |
2025.04.14 |
2025.04.21 |
2025.05.08 |
2025.05.23 |
|
PCB_2L_114D
PCB_4L_114D
PCB_2LHF16_114D PCB_4LMX_114D |
2025.06.09 |
2025.06.16 |
2025.07.02 |
2025.07.17 |
|
PCB_2L_114E
PCB_4L_114E
PCB_2LHF16_114E PCB_4LMX_114E |
2025.08.04 |
2025.08.11 |
2025.08.27 |
2025.09.11 |
|
PCB_2L_114F
PCB_4L_114F
PCB_2LHF16_114F PCB_4LMX_114F |
2025.09.22 |
2025.09.29 |
2025.10.17 |
2025.11.03 |
|
PCB_2L_114G
PCB_4L_114G
PCB_2LHF16_114G PCB_4LMX_114G |
2025.11.10 |
2025.11.17 |
2025.12.03 |
2025.12.18 |
PCB Contact
| PCB Process Code | PCB Fabrication Substance | Contact |
|---|---|---|
| PCB_2L |
FR4 2-Layer Board
|
Miss Lin
TEL: 03-5773693 ext. 7151
Email: sglin@niar.org.tw
|
| PCB_4LMX | RO4003C-FR4 4-Layer Complex Board | |
| PCB_2LHF16 | RO4003C 2-Layer High Frequency Board |
Miss Li
TEL: 03-5773693 ext. 7214
Email: elili@niar.org.tw
|
| PCB_4L | FR4 4-Layer Board |