PCB Process/ Schedule / Contact
PCB Process
| PCB Process Code | PCB Fabrication Substance | Stackup |
Metal Line Minimum Width / Spacing (mm) |
Drill Hole Minimum / Maximum Size (mm) |
|
|---|---|---|---|---|---|
| PCB_2L |
FR4 2-Layer Board
|
 |
0.1 / 0.1 | 0.20 / 6.00 | |
| PCB_4L | FR4 4-Layer Board |
 |
0.1 / 0.1 | 0.20 / 6.00 | |
| PCB_2LHF16 |
RO 2-Layer High Frequency Board
|
 |
0.1 / 0.1 | 0.20 / 6.00 | |
| PCB_4LMX | RO-FR4 4-Layer Complex Board |
 |
0.1 / 0.1 | 0.20 / 6.00 | |
PCB Schedule
| Batch | Application Start Date | Application Deadline | Payment Approval Deadline | PCB Shipment Date |
|---|---|---|---|---|
|
PCB_2L_114G
PCB_4L_114G
PCB_2LHF16_114G PCB_4LMX_114G |
2025.11.10 | 2025.11.17 | 2025.12.03 | 2025.12.18 |
|
PCB_2L_115A
PCB_4L_115A
PCB_2LHF16_115A PCB_4LMX_115A |
2025.12.29 |
2026.01.06 |
2026.01.22 |
2026.02.06 |
|
PCB_2L_115B
PCB_4L_115B
PCB_2LHF16_115B PCB_4LMX_115B |
2026.02.23 |
2026.03.03 |
2026.03.19 |
2026.04.07 |
|
PCB_2L_115C
PCB_4L_115C
PCB_2LHF16_115C PCB_4LMX_115C |
2026.04.13 |
2026.04.20 |
2026.05.07 |
2026.05.22 |
|
PCB_2L_115D
PCB_4L_115D
PCB_2LHF16_115D PCB_4LMX_115D |
2026.06.08 |
2026.06.15 |
2026.07.02 |
2026.07.17 |
|
PCB_2L_115E
PCB_4L_115E
PCB_2LHF16_115E PCB_4LMX_115E |
2026.08.03 |
2026.08.10 |
2026.08.26 |
2026.09.10 |
|
PCB_2L_115F
PCB_4L_115F
PCB_2LHF16_115F PCB_4LMX_115F |
2026.09.21 |
2026.09.30 |
2026.10.19 |
2026.11.03 |
|
PCB_2L_115G
PCB_4L_115G
PCB_2LHF16_115G PCB_4LMX_115G |
2026.11.09 |
2026.11.16 |
2026.12.02 |
2026.12.17 |
PCB Contact
| PCB Process Code | PCB Fabrication Substance | Contact |
|---|---|---|
| PCB_2L |
FR4 2-Layer Board
|
Miss Lin
TEL: 03-5773693 ext. 7151
Email: sglin@niar.org.tw
|
| PCB_4LMX | RO4003C-FR4 4-Layer Complex Board | |
| PCB_2LHF16 | RO4003C 2-Layer High Frequency Board |
Miss Li
TEL: 03-5773693 ext. 7214
Email: elili@niar.org.tw
|
| PCB_4L | FR4 4-Layer Board |