Application for Full-price Packaging/Dicing

For Full-price Dicing or Full-price Packaging, no process data authorization is required. The applicant can proceed with the service application after becoming a member of TSRI.
Before applying, please read the application instructions and required documents below.

Required Documents

Application Item	Instructions and Details	Reference Form	Required Documents	Pricing Policy
Full-price Dicing	Before proceeding, please verify the feasibility with the designated contact person. If feasible: Please download the "Waiver of Liability for Chip Dicing and Packaging" form, complete it with your signature, and upload the signed form when filling out the online application form. Please provide the cutting diagram and upload it when filling out the online application form.	Waiver of Liability for Chip Dicing and Packaging	1.Cutting Diagram 2.Wafers or Dies	The quotes will vary depending on the dicing method. For more details, please get in touch with the designated contact person.
Full-price Packaging	The minimum quantity for a single application is 8 chips, with no maximum limit. Please download the "Waiver of Liability for Chip Dicing and Packaging" form, complete it with your signature, and upload the signed form when filling out the online application form. Please provide the wire-bonding diagram and upload it when filling out the online application form.	Wire Bonding Diagram Template Download Wire-Bonding Diagram Examples Waiver of Liability for Chip Dicing and Packaging	1.Wire-Bonding Diagram 2.Dies	Please refer to Chip Implementation > Price List.

Shipping of Items

Mailing Address: No. 26, Prosperity Road I, Hsinchu Science Park, Hsinchu City 300091, Taiwan (Attn: Customer Service Team, TSRI)

Contact

For inquiries, please contact Ms. Fang-Lin Hsu; Ext. 7123
Email：fanglin@narlabs.org.tw