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Taiwan Semiconductor Research Institute

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Chip Implementation
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Home Chip ImplementationPCB/IPD/Flip Chip ImplementationIPD Process Fabrication
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IPD Process Fabrication

1. Service Instructions
1-1. Provide IPD Process information and precautions, please refer to "IPD Process Service Instructions" document.
1-2. Process Service will be implemented in accordance with relevant "Chip Implementation Instructions" documents.
1-3. IPD Process Application System

2. Fabrication Schedule

Process Code Process Description Annual Batch No.
WIPD WIN Integrated Passive Device 2

Batch Application Start Date Educational Chip
Application Deadline
Advanced Chip
Application Deadline
Advanced Chip Fast Review
Application Deadline
Academia Full-price
Application Deadline
Review Meeting First Stage
Approval Deadline
Chip Out Test Plan
Submit Deadline
WIPD-114A 2025.02.03 X 2025.02.10 X 2025.02.17 NA 2025.02.26 2025.06.02 2025.08.08
WIPD-114B 2025.07.28 X 2025.08.04 X 2025.08.11 NA 2022.08.20 2025.11.24 2026.02.06

3. Contact
Mr. Lin
TEL:03-5773693 ext. 7212
Email:tylin@niar.org.tw
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Customer Service:tsri-cs@niar.org.tw ext:7610
  • Hsinchu Base
    No.26, Prosperity Road I, Hsinchu Science Park, Hsinchu 300091, Taiwan, R.O.C.
    TEL. +886-3-5773693FAX. +886-3-5713403
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    No.25, Xiaodong Road, Tainan City 704017, Taiwan, R.O.C.
    TEL. +886-6-2090160FAX. +886-6-2086669
  • NCKU Chimei Office
    7F, Chimei Building, Tzu-Chiang Campus, No.1, University Road, Tainan City 701401, Taiwan, R.O.C.
    TEL. +886-6-2087971FAX. +886-6-2089122
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