Taiwan Semiconductor Research Institute, NARLabs.

Price List

User Self-service of the Academia：Charge at 10% of the listed price.
OEM Service of the Academia (including Academia Sinica)：Technical service fee is assessed at a rate of *10% of the academia's pricing, with materials incurring a 100% charge.
User Self-service of the Industry：Not available.
OEM Service of the Industry：Charge based on the industry's pricing.

Notes：

For User Self-service or OEM Service, please go to Manufacturing and Measurement Analysis Service System / MES System.
For OEM service, if the duration is less than half an hour (30 minutes), it will be billed as half an hour.

Equipment of Lithography and Mask

No.	Equipment		User Self-service		OEM Service
			User Self-service		Start-up Fee(NTD/time)	Usage Fee
			Start-up Fee(NTD/time)	Usage Fee(NTD/min)	Start-up Fee(NTD/time)	Academia(NTD/min)	Industry(NTD/h)
CF-C05	FEOL 6" WET BENCH	Clean Area SPM	0	60	0	89	6,100
	FEOL 6" WET BENCH	Clean Area SC-2	0	60	0	89	6,100
	FEOL 6" WET BENCH	Clean Area DHF	0	60	0	89	6,100
	FEOL 6" WET BENCH	Clean Area SC-1	0	60	0	89	6,100
	FEOL 6" WET BENCH	PR Area SPM1	0	60	0	89	6,100
	FEOL 6" WET BENCH	PR Area SPM2	0	60	0	89	6,100
	FEOL 6" WET BENCH	PR Area B.O.E. 7:1	0	60	0	89	6,100
	FEOL 6" WET BENCH	Metal PR Stripping	0	60	0	89	7,250
	FEOL 6" WET BENCH	H3PO4( 8”)	0	60	0	89	6,100
	FEOL 6" WET BENCH	B.O.E.7:1 (8”)	0	60	0	89	6,100
CF-C06	BEOL 6" WET BENCH	H2SO4	0	60	0	89	6,100
CF-C06	BEOL 6" WET BENCH	B.O.E.7:1	0	60	0	89	6,100
CF-C08	8" Chemical Mechanical Polishing System		Academia：1,500 Industry：4,000 (N/A User Self-service)	83	Academia：1,500 Industry：5,000	133 Material Fee: 400 (NTD/wafer)	9,000 Material Fee: 400 (NTD/wafer)
CF-C09	BEOL 8" WET BENCH		0	80	0	97	168 (NTD/min)
CF-C10	FEOL 8" WET BENCH		0	99	0	124	124 (NTD/min)
CF-C11	FEOL 8" Chemical Mechanical Polishing System		N/A	N/A	5,000	333	19,980
CF-L02A	Photo Mask Production Service		N/A		0	217	433 (NTD/min)
	Photo Mask Production Service	Photo Mask Production-Review Mask Data	N/A		0	900 (NTD/h)	900
		Photo Mask Production-Modify Gds File	N/A		0	1,300 (NTD/h)	1,300
		QZ Mask	N/A		4,000 (NTD/wafer)
		Glass Mask	N/A		2,500 (NTD/wafer)
CF-L02W	6" Leica E-beam Direct Writing System		0	167	0	217	26,000
CF-L05	I-line Stepper		0	200	Industry：30,000	250	27,500
CF-L06	6" In-line SEM		0	1 (NTD/s)	Industry：20,000	178	13,200
CF-L09	6" Track		0	2 (NTD/s)	Industry：20,000	203 Material Fee: 345 (NTD/wafer)	14,150 Material Fee: 345 (NTD/wafer)
CF-L13	6" FIB-dual Beam System	Wafer Level SEM Cross-Sectional Inspection	N/A		0	4,500 (NTD/h)	7,000
CF-L13	6" FIB-dual Beam System	Wafer Level TEM Sample Preparation	N/A		0	10,500 (NTD/pcs)	15,000 (NTD/pcs)
CF-L16	8" S9260A In-line SEM		N/A		0	223	223 (NTD/min)
CF-L17	8" Track System		0	151	0	244 Material Fee: 345 (NTD/wafer)	244 (NTD/min) Material Fee: 345 (NTD/wafer)
CF-L18	8" Focused Ion Beam System	--	N/A		0	405	405 (NTD/min)
CF-L18	8" Focused Ion Beam System	Wafer level TEM Sample Preparation	N/A		0	12,500 (NTD/pcs)	17,000 (NTD/pcs)
CF-L19	Variable Shaped E-beam Lithography System		N/A		0	474	474 (NTD/min)
CF-L20	Die-Grade Pattern Definition Contact Alignment System		0	138	0	205	205 (NTD/min)
CF-L21	Mask Track		N/A		Material Fee: 2,500 (NTD/wafer)	50	3,000
CF-L22	248-nm DUV Scanner		N/A		0	858 (NTD/min)	858 (NTD/min)
CF-M13	Stress Measurement System		0	23	1,000	48	3,160
CF-M19	Metal 4 Point Probe		0	0.4 (NTD/s)	0	1,800 (NTD/h)	1,800
CF-M23	NK1500-thin Film Measurement System		0	50	0	67	4,500
CF-M24	Surfscan Analyzer		0	48	0	73	5,000
CF-M25	Ellipsometer M2000		0	67	0	100	100 (NTD/min)
CF-M28	White Light Interferometry		0	18	0	35	53 (NTD/min)
R414	Chemical Laboratory		0	5	N/A

Equipment of Etch and Thin Film

No.	Equipment		User Self-service		OEM Service
			User Self-service		Start-up Fee(NTD/time)	Usage Fee
			Start-up Fee(NTD/time)	Usage Fee(NTD/min)	Start-up Fee(NTD/time)	Academia(NTD/min)	Industry(NTD/h)
CF-E01	TCP 9400-FEOL 6” Etcher(TCP POLY-SILICON ETCHER)		0	25	0	91	6,000
CF-E07	Mattson ASPEN Asher		0	42	0	79	5,500
CF-E08	Lam TCP9600 metal etcher		0	25	0	91	6,000
CF-E09	ICP Etcher		Industry：2,000 (N/A User Self-service)	71	Academia：4,000	100	7,000
CF-E10	LAM2300-FEOL 8” Etcher		N/A		0	250	15,000
CF-E11	LAM2300-BEOL 8” Etcher		N/A		0	250	15,000
CF-E13	AMAT ALE		N/A		0	350	21,000
CF-E14	P-17 Surface Profiler		0	28	0	53	3,200
CF-E15	IBE		N/A		0	21,500 (NTD/h)	21,500
CF-E16	SAMCO Low Damage GaN Etcher		N/A		0	20	12,000
CF-M11	Laser Marker		0	58	0	98	6,048
CF-M26	TXRF		0	87	0	112	10,080
RDT004	Rapid Thermal Annealing		0	18 (General Process)	2,000	52	66 (NTD/min)
RDT004	Rapid Thermal Annealing		2,000	18 (Ge & Hight K)	2,000	52	66 (NTD/min)
RDT007	SYSKEY ALD		N/A		0	100	6,000
CF-S06	Implantation (Medium Cruuent)		N/A		0	4,130 (NTD/h)	5,500
CF-S08	GaN RTA		2,000	31	2,000	56	3,350
CF-S09	PIII		N/A		0	17.5	10,500
CF-S09	PIII		N/A		0	Material Fee: 400 (NTD/wafer)
CF-T03	Horizontal Furnace	T01 Poly Si	0	0.3 (NTD/s)	0	1,000 (NTD/h)	1,000
		T02 Nitride	0	0.5 (NTD/s)	0	2,000 (NTD/h)	2,000
		T03 TEOS	0	0.6 (NTD/s)	0	2,500 (NTD/h)	2,500
		T04 Dope-AMM	0	0.3 (NTD/s)	0	1,100 (NTD/h)	1,100
		T05 Wet Oxide	0	20	0	20	1,200
		T05、6、7 Dry Oxide	0	20	0	1,200 (NTD/h)	1,200
		T06 Drive-In	0	20	0	20	1,200
		T07 P+ Anneal	0	20	0	20	1,700
		T08 H2 Sinter	0	0.5 (NTD/s)	0	2,000 (NTD/h)	2,000
CF-T13	Vertical Furnace
		Dry Oxide	N/A		0	27	1,500
		Wet Oxide	N/A		0	27	1,600
		Insitu Doped Poly	N/A		0	27	2,000
CF-T17	Backend Vacuum Anneal Furnace		1,000	25	1,000	52	4,090
CF-T19	Oxford PECVD		0	43	1,000	75	5,500
CF-T21	E-gun System		2,000	13	3,000	30	2,000
CF-T23	FSE Cluster PVD		Industry：4,000	77	Industry：4,000	110	8,000
CF-T25	WCVD		Academia：1,000 Industry：4,000 (N/A User Self-service)	102	Academia：1,000 Industry：4,000	139	9,000
CF-T26	PECVD		N/A		0	117	7,020
CF-T28	HDPCVD		N/A		0	179	10,740
CF-T29	8” PVD		N/A		0	208	12,480
CF-T31	12” PVD		N/A		0	420	25,200
CF-T31	12” PVD		N/A		0	10,000 (NTD/wafer)
CF-T32	VEECO ALD		N/A		0	150	9,000
CF-T32	VEECO ALD		N/A		0	Material Fee: 37 (NTD/cycle)
CF-T33	MOCVD		N/A		0	12,500(NTD/h)	12,500
CF-T33	MOCVD		N/A		0	EPI Material Fee: 12000 (NTD/wafer (Si)) 39000 (NTD/wafer (SiC))

Equipment of Device Technology

No.	Equipment		User Self-service		OEM Service
			User Self-service		Start-up Fee(NTD/time)	Usage Fee
			Start-up Fee(NTD/time)	Usage Fee(NTD/min)	Start-up Fee(NTD/time)	Academia(NTD/min)	Industry(NTD/h)
RDT003	Low Temperature Microwave Annealing System		N/A		0	100	100 (NTD/min)
RDT005	Group IV Materials Epitaxy Tool	Usage Fee	N/A		0	367	367 (NTD/min)
RDT005	Group IV Materials Epitaxy Tool	Material Fee	N/A		0	134	8000
RDT009	III-V Metal Organic Chemical Vapor Deposition System (III-V MOCVD)		N/A		3,000	113	227 (NTD/min)
CF-S07	Laser Processing System		N/A		1,000	41	4,000