Price List
- User Self-service of the Academia：Charge at 10% of the listed price.
- OEM Service of the Academia (including Academia Sinica)：Technical service fee is assessed at a rate of *10% of the academia's pricing, with materials incurring a 100% charge.
- User Self-service of the Industry：Not available.
- OEM Service of the Industry：Charge based on the industry's pricing.
- For User Self-service or OEM Service, please go to Manufacturing and Measurement Analysis Service System / MES System.
- For OEM service, if the duration is less than half an hour (30 minutes), it will be billed as half an hour.
Equipment of Lithography and Mask
| No. | Equipment | User Self-service | OEM Service | ||||
|---|---|---|---|---|---|---|---|
| Start-up Fee(NTD/time) | Usage Fee | ||||||
| Start-up Fee(NTD/time) | Usage Fee(NTD/min) | Academia(NTD/min) | Industry(NTD/h) | ||||
| CF-C05 | FEOL 6" WET BENCH | Clean Area SPM | 0 | 60 | 0 | 89 | 6,100 |
| FEOL 6" WET BENCH | Clean Area SC-2 | 0 | 60 | 0 | 89 | 6,100 | |
| FEOL 6" WET BENCH | Clean Area DHF | 0 | 60 | 0 | 89 | 6,100 | |
| FEOL 6" WET BENCH | Clean Area SC-1 | 0 | 60 | 0 | 89 | 6,100 | |
| FEOL 6" WET BENCH | PR Area SPM1 | 0 | 60 | 0 | 89 | 6,100 | |
| FEOL 6" WET BENCH | PR Area SPM2 | 0 | 60 | 0 | 89 | 6,100 | |
| FEOL 6" WET BENCH | PR Area B.O.E. 7:1 | 0 | 60 | 0 | 89 | 6,100 | |
| FEOL 6" WET BENCH | Metal PR Stripping | 0 | 60 | 0 | 89 | 7,250 | |
| FEOL 6" WET BENCH | H3PO4( 8”) | 0 | 60 | 0 | 89 | 6,100 | |
| FEOL 6" WET BENCH | B.O.E.7:1 (8”) | 0 | 60 | 0 | 89 | 6,100 | |
| CF-C06 | BEOL 6" WET BENCH | H2SO4 | 0 | 60 | 0 | 89 | 6,100 |
| BEOL 6" WET BENCH | B.O.E.7:1 | 0 | 60 | 0 | 89 | 6,100 | |
| CF-C08 | 8" Chemical Mechanical Polishing System |
Academia：1,500 Industry：4,000 (N/A User Self-service) |
83 |
Academia：1,500 Industry：5,000 |
133 Material Fee: 400 (NTD/wafer) |
9,000
Material Fee: 400 |
|
| CF-C09 | BEOL 8" WET BENCH | 0 | 80 | 0 | 97 |
168 (NTD/min) |
|
| CF-C10 | FEOL 8" WET BENCH | 0 | 99 | 0 | 124 |
124 (NTD/min) |
|
| CF-C11 | FEOL 8" Chemical Mechanical Polishing System | N/A | N/A | 5,000 | 333 | 19,980 | |
| CF-L02A | Photo Mask Production Service | N/A | 0 | 217 |
433 (NTD/min) |
||
| Photo Mask Production Service | Photo Mask Production-Review Mask Data | N/A | 0 |
900 (NTD/h) |
900 | ||
| Photo Mask Production-Modify Gds File | N/A | 0 |
1,300 (NTD/h) |
1,300 | |||
| QZ Mask | N/A |
4,000 (NTD/wafer) |
|||||
| Glass Mask | N/A |
2,500 (NTD/wafer) |
|||||
| CF-L02W | 6" Leica E-beam Direct Writing System | 0 | 167 | 0 | 217 | 26,000 | |
| CF-L05 | I-line Stepper | 0 | 200 | Industry：30,000 | 250 | 27,500 | |
| CF-L06 | 6" In-line SEM | 0 |
1 (NTD/s) |
Industry：20,000 | 178 | 13,200 | |
| CF-L09 | 6" Track | 0 |
2 (NTD/s) |
Industry：20,000 |
203 Material Fee: 345 (NTD/wafer) |
14,150
Material Fee: 345 (NTD/wafer) |
|
| CF-L13 | 6" FIB-dual Beam System | Wafer Level SEM Cross-Sectional Inspection | N/A | 0 |
4,500 (NTD/h) |
7,000 | |
| Wafer Level TEM Sample Preparation | N/A | 0 |
10,500 (NTD/pcs) |
15,000 (NTD/pcs) |
|||
| CF-L16 | 8" S9260A In-line SEM | N/A | 0 | 223 |
223 (NTD/min) |
||
| CF-L17 | 8" Track System | 0 | 151 | 0 |
244
Material Fee: 345 (NTD/wafer) |
244
Material Fee: 345 (NTD/wafer) |
|
| CF-L18 | 8" Focused Ion Beam System | -- | N/A | 0 | 405 |
405 (NTD/min) |
|
| Wafer level TEM Sample Preparation | N/A | 0 |
12,500 (NTD/pcs) |
17,000 (NTD/pcs) |
|||
| CF-L19 | Variable Shaped E-beam Lithography System | N/A | 0 | 474 |
474 (NTD/min) |
||
| CF-L20 | Die-Grade Pattern Definition Contact Alignment System | 0 | 138 | 0 | 205 |
205 (NTD/min) |
|
| CF-L21 | Mask Track | N/A | Material Fee: 2,500 (NTD/wafer) | 50 | 3,000 | ||
| CF-L22 | 248-nm DUV Scanner | N/A | 0 |
858 (NTD/min) |
858 (NTD/min) |
||
| CF-M13 | Stress Measurement System | 0 | 23 | 1,000 | 48 | 3,160 | |
| CF-M19 | Metal 4 Point Probe | 0 |
0.4 (NTD/s) |
0 |
1,800 (NTD/h) |
1,800 | |
| CF-M23 | NK1500-thin Film Measurement System | 0 | 50 | 0 | 67 | 4,500 | |
| CF-M24 | Surfscan Analyzer | 0 | 48 | 0 | 73 | 5,000 | |
| CF-M25 | Ellipsometer M2000 | 0 | 67 | 0 | 100 |
100 (NTD/min) |
|
| CF-M28 | White Light Interferometry | 0 | 18 | 0 | 35 |
53 (NTD/min) |
|
| R414 | Chemical Laboratory | 0 | 5 | N/A | |||
Equipment of Etch and Thin Film
| No. | Equipment | User Self-service | OEM Service | ||||
|---|---|---|---|---|---|---|---|
| Start-up Fee(NTD/time) | Usage Fee | ||||||
| Start-up Fee(NTD/time) | Usage Fee(NTD/min) | Academia(NTD/min) | Industry(NTD/h) | ||||
| CF-E01 | TCP 9400-FEOL 6” Etcher(TCP POLY-SILICON ETCHER) | 0 | 25 | 0 | 91 | 6,000 | |
| CF-E07 | Mattson ASPEN Asher | 0 | 42 | 0 | 79 | 5,500 | |
| CF-E08 | Lam TCP9600 metal etcher | 0 | 25 | 0 | 91 | 6,000 | |
| CF-E09 | ICP Etcher |
Industry：2,000 (N/A User Self-service) |
71 | Academia：4,000 | 100 | 7,000 | |
| CF-E10 | LAM2300-FEOL 8” Etcher | N/A | 0 | 250 | 15,000 | ||
| CF-E11 | LAM2300-BEOL 8” Etcher | N/A | 0 | 250 | 15,000 | ||
| CF-E13 | AMAT ALE | N/A | 0 | 350 | 21,000 | ||
| CF-E14 | P-17 Surface Profiler | 0 | 28 | 0 | 53 | 3,200 | |
| CF-E15 | IBE | N/A | 0 |
21,500 (NTD/h) |
21,500 | ||
| CF-E16 | SAMCO Low Damage GaN Etcher | N/A | 0 | 20 | 12,000 | ||
| CF-M26 | TXRF | 0 | 87 | 0 | 112 | 10,080 | |
| RDT004 | Rapid Thermal Annealing | 0 |
18 (General Process) |
2,000 | 52 |
66 (NTD/min) |
|
| 2,000 |
18 (Ge & Hight K) |
||||||
| RDT007 | SYSKEY ALD | N/A | 0 | 100 | 6,000 | ||
| CF-S06 | Implantation (Medium Cruuent) | N/A | 0 |
4,130 (NTD/h) |
5,500 | ||
| CF-S08 | GaN RTA | 2,000 | 31 | 2,000 | 56 | 3,350 | |
| CF-S09 | PIII | N/A | 0 | 17.5 | 10,500 | ||
| Material Fee: 400 (NTD/wafer) | |||||||
| CF-T03 | Horizontal Furnace | T01 Poly Si | 0 |
0.3 (NTD/s) |
0 |
1,000 (NTD/h) |
1,000 |
| T02 Nitride | 0 |
0.5 (NTD/s) |
0 |
2,000 (NTD/h) |
2,000 | ||
| T03 TEOS | 0 |
0.6 (NTD/s) |
0 |
2,500 (NTD/h) |
2,500 | ||
| T04 Dope-AMM | 0 |
0.3 (NTD/s) |
0 |
1,100 (NTD/h) |
1,100 | ||
| T05 Wet Oxide | 0 | 20 | 0 | 20 | 1,200 | ||
| T05、6、7 Dry Oxide | 0 | 20 | 0 |
1,200 (NTD/h) |
1,200 | ||
| T06 Drive-In | 0 | 20 | 0 | 20 | 1,200 | ||
| T07 P+ Anneal | 0 | 20 | 0 | 20 | 1,700 | ||
| T08 H2 Sinter | 0 |
0.5 (NTD/s) |
0 |
2,000 (NTD/h) |
2,000 | ||
| CF-T13 | Vertical Furnace | ||||||
| Dry Oxide | N/A | 0 | 27 | 1,500 | |||
| Wet Oxide | N/A | 0 | 27 | 1,600 | |||
| Insitu Doped Poly | N/A | 0 | 27 | 2,000 | |||
| CF-T17 | Backend Vacuum Anneal Furnace | 1,000 | 25 | 1,000 | 52 | 4,090 | |
| CF-T19 | Oxford PECVD | 0 | 43 | 1,000 | 75 | 5,500 | |
| CF-T21 | E-gun System | 2,000 | 13 | 3,000 | 30 | 2,000 | |
| CF-T23 | FSE Cluster PVD | Industry：4,000 | 77 | Industry：4,000 | 110 | 8,000 | |
| CF-T25 | WCVD |
Academia：1,000 Industry：4,000 (N/A User Self-service) |
102 |
Academia：1,000 Industry：4,000 |
139 | 9,000 | |
| CF-T26 | PECVD | N/A | 0 | 117 | 7,020 | ||
| CF-T28 | HDPCVD | N/A | 0 | 179 | 10,740 | ||
| CF-T29 | 8” PVD | N/A | 0 | 208 | 12,480 | ||
| CF-T31 | 12” PVD | N/A | 0 | 420 | 25,200 | ||
|
10,000 (NTD/wafer) |
|||||||
| CF-T32 | VEECO ALD | N/A | 0 | 150 | 9,000 | ||
| Material Fee: 37 (NTD/cycle) | |||||||
| CF-T33 | MOCVD | N/A | 0 | 12,500(NTD/h) | 12,500 | ||
|
EPI Material Fee: 12000 (NTD/wafer (Si)) 39000 (NTD/wafer (SiC)) |
|||||||
Equipment of Device Technology
| No. | Equipment | User Self-service | OEM Service | ||||
|---|---|---|---|---|---|---|---|
| Start-up Fee(NTD/time) | Usage Fee | ||||||
| Start-up Fee(NTD/time) | Usage Fee(NTD/min) | Academia(NTD/min) | Industry(NTD/h) | ||||
| RDT003 | Low Temperature Microwave Annealing System | N/A | 0 | 100 |
100 (NTD/min) |
||
| RDT005 | Group IV Materials Epitaxy Tool | Usage Fee | N/A | 0 | 367 |
367 (NTD/min) |
|
| Material Fee | N/A | 0 | 134 | 8,000 | |||
| RDT010 | 8” Bonder | N/A | 0 | 6 |
53 (NTD/min) |
||
| CF-S07 | Laser Processing System | N/A | 1,000 | 41 | 4,000 | ||