Home Chip ImplementationProcess/Silicon Intellectual Property(SIP)Process/SIP Application
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Process/SIP Application

Application for Authorization to Use Process/Semiconductor Intellectual Property —— click here to enter

Application Instructions
  1. Applicants (full-time teachers) and authorized users should thoroughly review the relevant process information documents and forms.
  2. Process information usage is granted on an annual basis, valid from the date of authorization opening until December 31st of the respective year.
  3. If there are any changes to the IP for downloading or storing process data, please submit an "IP Modification Application Form."
  4. If the applicant intends to authorize users from other schools (i.e, the applicant and authorized users are not from the same school), please inquire with the designated point of contact before proceeding with the application.
  5. If the applicant/authorized user does not hold Taiwanese citizenship, please inquire with the designated point of contact before applying.
  6. Those who have not obtained permission to use the process technology from TSRI are not allowed to apply for advanced/educational chip manufacturing.
  7. If the applicant publishes a paper based on the various processes provided by TSRI, TSRI (Taiwan Semiconductor Research Institute) and the original process data providers’ names should be mentioned in the paper.
  8. For the TSMC University FinFET Program (N7, N16, ADFP processes) application questionnaire, please download it from the link provided below.
  9. Please note that starting from the academic year 113, both applicants and authorized users applying for process privileges are required to pass the Legal Literacy Advocacy Test

Usage Categories SL Process EDA Cloud Process General Process Encrypted Process Virtual Process TSMC FinFET Program
Process Code
  • TN16FFC
  • AISOC
  • TN28HPCplu
  • TN40G
  • TN90GUTM
  • T18
  • SiGe18
  • D35
  • T18HVG2
  • T50GaN
  • U18
  • P15
  • GaN12
  • GaN25
  • GIPD
  • IMEC-SiPh
  • WIPD
  • TN90GUTM-E
  • T18-E
  • SiGe18-E
  • D35-E
  • C18
  • TN7
  • TN16FFC-P
  • ADFP
*After completing the application,you can download technical data and documents.
Correspondence table of process code and process name
Related Procedure Complete The Submission of Related Documents
↓
Obtain Authorization
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Use in SL		 Complete The Submission of Related Documents
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Obtain Authorization
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Create EDA Cloud Account
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Use in EDA Cloud		 Complete The Submission of Related Documents
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Obtain Authorization
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Download File and Use		 Complete The Submission of Related Documents
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Pass the Information Security Audit and the Information Security Course Exam
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Obtain Authorization
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Download File and Use		 Complete Data
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Obtain Authorization
↓
Download File and Use		 Complete Data
↓
Obtain Authorization
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Download File and Use
Documents to be Submitted
(Please download from the system)
  1. Process Information Application Form(one hard copy)
  2. User List (Excel file)
  3. TSMC NDA Main Document(Non-Disclosure Agreement; three hard copies)
  4. TSMC NDA Attachment (two hard copies)
  1. Process Information Usage Application Form(one hard copy)
  2. User List(Excel file)
  3. TSMC NDA Main Document(Non-Disclosure Agreement; three hard copies)
  4. TSMC NDA Attachment(two hard copies)
  5. Semiconductor Intellectual Property Usage Application Form(one hard copy: applicable for T18HVG2/TN90GUTM IP)
  1. Process Information Application Form(one hard copy)
  2. User List span class="font-xsmall gray">(Excel file)
  3. To apply for the IMEC-SiPh process, it’s necessary to sign contracts and related documents with the manufacturer. For more information, please contact the Process Application Business Contact Point.
  4. Semiconductor Intellectual Property Usage Manual (one hard copy: applicable for U18 IP)
  1. Process Information Application Form (one hard copy)
  2. User List(Excel file)
  3. TSMC NDA Main Document(Non-Disclosure Agreement; three hard copies)
  4. TSMC NDA Attachment(two hard copies)
  5. Encrypted Process Information Protection Statement (one hard copy)
  6. Self-Checklist for Encrypted Process Information Management and Supporting Documents (one hard copy each: submitted every six months)；please refer to the Sample Supporting Documents for Process Data Encryption Environment.
  1. Process Information Application Form(one hard copy)
  2. User List (Excel file)
 *Applicants must first submit the TSMC University FinFET Program Application Questionnaire, and may apply only after approval by TSMC.
  1. A.Process Information Application Form-FinFET Program(one hard copy；exclusively for TN7, TN16FFC-P process)
  2. B.Process Information Application Form-ADFP process(one hard copy；exclusively for ADFP process)
  3. User List (Excel file;Applicants for ADFP process are not required to submit)
  4. TSMC FinFET Program NDA Main Document(signed by three parties)
  5. TSMC FinFET Program NDA Attachment(Exhibit C- Acknowledgement Form & Exhibit E;Applicants for ADFP process are not required to submit)
TSMC NDA - TSMC Process Three-Way Confidentiality Agreement：
  1. Main Text (lifetime agreement): three copies, submitted by the university during the initial application. Each should be signed by representatives from the university, TSMC, and TSRI. Following the completion of the signing process, each party keeps one signed copy.
  2. Appendix (lifetime agreement): three copies, signed by the applying professor and the authorized user; two copies should be sent to TSRI, and one copy should be retained by the school/applying professor. If the authorized user changes affiliation or or falls under a different professor, a re-signing procedure is required.
IMEC Process Usage Agreement - IMEC Process Bilateral (DKL) and Tripartite Authorization Agreement：
  1. DKL from both parties: in duplicate, with the school department as the unit and signed when each department applies for the first time. It is signed by representatives of the school department and IMEC. Once signed, one copy will be retained by the school department and IMEC.
  2. Authorization Letter: in triplicate, signed by the university department as a unit, signed by representatives of the university department, IMEC, and TSRI. Once signed, each of the three parties will keep one copy.


Form Downloads
Process/Semiconductor Intellectual Property Application Checklist
Encrypted Process Information Application and Usage Guidelines
Encrypted Process Information Destruction Confirmation Form (one hard copy: submit when suspended or no longer in use)
IP Modification Application Form
List of University Representative's Completion of TSMC NDA Signing Checklist
LIst of Department Representative's Completion of IMEC Contract Signing Checklist
TSMC University FinFET Program Application Questionnaire  (after completing the questionnaire, please send it to kangchu@narlabs.org.tw )

Document Delivery
Mailing Address: No.26, Prosperity Road I, Hsinchu Science Park, Hsinchu 300091, Taiwan, R.O.C. (Taiwan Semiconductor Research Institute),
Attn: Process/Semiconductor Intellectual Property Application Processing Team
E-mail：tsri-process@narlabs.org.tw TEL：03-5773693 FAX：03-5679451

TSMC FinFET Program (including ADFP)
List of University Representatives with Completion of TSMC University FinFET Program NDA Signing
For application or other related questions, please fill out the inquiry form in the "Customer Consulting System".

Point of Contact
For technical issues, please go to "Customer Service Consulting".
For service application, please contact Ms. Chang; ext. 7174.