Price List
- User Self-service of the Academia:Charge at 10% of the listed price.
- OEM Service of the Academia (including Academia Sinica):Technical service fee is assessed at a rate of *10% of the academia's pricing, with materials incurring a 100% charge.
- User Self-service of the Industry:Not available.
- OEM Service of the Industry:Charge based on the industry's pricing.
- For User Self-service or OEM Service, please go to the Manufacturing and Measurement Analysis Service System / MES System.
- For OEM service, if the duration is less than half an hour (30 min), it will be billed as half an hour.
List of Equipment in Tainan
No. | Equipment | User Self-service | OEM Service | |||
---|---|---|---|---|---|---|
Start-up Fee(NTD/time) | Usage Fee | |||||
Start-up Fee(NTD/time) | Usage Fee(NTD/min) | Academia(NTD/min) | Industry(NTD/h) | |||
SE-001 | PECVD&ICP | 0 | 50 | 1,000 | 58 | 6,000 |
SE-002 | STS | 0 | 17 | 0 | 42 | 5,500 |
SE-003 | Sputter | 0 | 22 | 0 | 38 | 2,800 |
SE-005 | Four Point Probe | 0 |
0.1 (NTD/s) |
0 | N/A | |
SE-007 | N&K Analyzer | 0 |
0.3 (NTD/s) |
0 |
1,500 (NTD/h) |
1,500 |
SE-009 | Track | 0 | 27 | 0 | 35 |
35 (NTD/min) |
Material Fee |
350 (NTD/wafer) |
|||||
SE-010 | Mask Aligner | 0 | 50 | 20,000 | 50 | 14,000 |
SE-011 | RF Sputter | 0 | 13 | 0 | N/A | |
SE-013 | PR Strip & Wet Etching Chemical Hood | 0 | 18 | 0 | N/A | |
SE-014 | Spin Coater | 0 | 5 | 0 | N/A | |
SE-016 | Thermal Coater | 0 | 11 | 0 | 36 | 3,500 |
SE-017 | MJB3 | 0 | 6 | 0 | N/A | |
SE-019 | Profile Meter | 0 | 17 | 1,000 | 33 | 2,000 |
SE-023 | 3D Laser Microscopy | 0 | 16 | 0 | 33 |
50 (NTD/min) |
SE-024 | Chip To Wafer Bonder | 0 | 44 | 0 | 60 |
60 (NTD/min) |
SE-025 | Wafer To Wafer Bonder | 0 | 45 | 0 | 62 |
62 (NTD/min) |
Material Fee |
5,000 (NTD/wafer) |
|||||
SE-026 | Laser Debonder | 0 | 67 | 0 | 83 |
83 (NTD/min) |
SE-027 | Wafer Thinning System (Grinder) | 0 | 18 | 0 | 35 |
35 (NTD/min) |
SE-028 | Electron Beam & Thermal Evaporation Deposition System | 0 | 40 | 0 | 50 |
50 (NTD/min) |
SE-029 | RTP System | 0 | 17 | 0 | 25 |
25 (NTD/min) |
SE-030 | Cluster RF Sputter | 0 | 30 | 0 | 40 |
40 (NTD/min) |
SE-031 | Chemical-Mechanical Polishing (CMP) | 0 | 73 | 1,000 | 106 | 6,940 |
SE-032 | Atomic Layer Deposition (ALD) | 0 | 28 | 0 | 37 |
37 (NTD/min) |
Material Fee |
6 (NTD/cycle) |
|||||
SE-033 | ELIONIX ELS7500-EX | 0 | 35 | Industry:20,000 | 52 | 6,000 |
SE-034 | Wet Bench – RCA Cleaning | 0 | 40 | 0 | 42 | 2,500 |
SE-C04 | UV-VIS-NIR Spectrophotometer | 0 | 20 | 0 | 36 | 2,340 |
SE-C14 | Gold Sputter | 0 |
0.2 (NTD/s) |
0 | N/A | |
SE-C15 | SEM | 0 | 19 | 0 | 40 | 2,500 |