CMOS MEMS 3-axis Accelerometer
Technology description：
To realize wearable or IoT application chip modules, sensor chips are manufactured using IDM’s special sensor process in conjunction with a special connection process and application circuit for packaging and mass production. For traditional fabless IC design companies, due to process limits specific to the manufacturing of sensors, which make integration with a readout circuit or back-end circuit on a single crystal unachievable, it is difficult for companies to advance the development of relevant fields. Through the CMOS MEMS platform, a new MEMS sensor industry model can be created, allowing traditional fabless IC design companies and manufacturers to easily develop sensor SOCs together, significantly improving integration efficiency in terms of verification timeliness, and optimizing chip and outer packaging size. This delivers an extremely large competitive edge in wearable or IoT applications.
Vendor qualifications:
Companies with experience in the design/development, verification, and sale of ICs.
Application method:
Vendors that are interested may fill out the attached application form and provide photocopies of the following documents. They must send the form and photocopies to the TSRI’s contact as qualification review information by registered mail prior to the application deadline (the 20th day from the date of announcement).
Required photocopies:
Photocopy of the certification of registration or incorporation
Contact:
Mr. Lo 03-5773693 ext. 7635
E-mail: cglo@narlabs.org.tw
E-mail: cglo@narlabs.org.tw